Join us for a relaxed and insightful morning coffee session diving into the latest developments in semiconductor technology with Tuomas Lahtinen from Tampere University! Chip packaging is rapidly becoming a central engine of semiconductor innovation as the industry moves toward heterogeneous integration and advanced packaging solutions. This talk outlines major wide bandage packaging trends and their impact on future electronics. It also provides an update on the SiPFAB pilot line at Tampere University, highlighting recent progress, emerging capabilities and collaboration opportunities, and introduces the broader chip packaging activities at TAU. Agenda: Key trends in advanced chip packaging and their impact on future electronics. Latest update on the SiPFAB pilot line highlighting recent progress, emerging capabilities and collaboration opportunities. Overview of TAU’s chip‑packaging activities. For whom: For anyone interested in the semiconductor and chip development activities. Register Copy the event page link