The director of the chip pilot line, who has been in the position for half a year, says that the cleanroom will be completed in Hervanta, Tampere, between 2027 and 2028. There is currently no comparable research-oriented packaging line in Finland, he notes. Chips from Tampere x Future Mobile Work Machines brought together experts from the chip and mobile machinery industries. Text, photos and video: Petri Kangas / Business Tampere Finland’s first pilot line specializing in chip packaging will be established in Hervanta, Tampere, during 2027–2028, says Tuomas Lahtinen. The SiPFAB Director has worked on the project since spring 2025. According to him, the efforts have progressed on three fronts: besides the cleanroom, the team has focused on preparing industry collaboration and initiating recruitments. “We are currently starting the recruitment process. Within five years, the goal is to hire 20 people for this project,” Lahtinen estimates. Regarding companies, Lahtinen reveals that the main focus so far has been on firms working in the field of power electronics. Better together Business Tampere interviewed Lahtinen at the event that connected the semiconductor and mobile work machine sectors. At the Chips from Tampere x Future Mobile Work Machines event, experts in microelectronics and intelligent work machinery gathered at Technopolis Yliopistonrinne in Tampere. The event took place on Wednesday afternoon, October 8. Discussions highlighted new semiconductor innovations, Tampere University’s System-on-Chip (SoC) development and its opportunities for the heavy-duty machinery industry, as well as the future of System-in-Package (SiP) chip integration. Pasi Pylväs (FiCCC) discussed the role of semiconductors in developing smarter machines, while Tuomas Lahtinen (Tampere University) presented future prospects for packaging technology. Company perspectives were shared by Pekka Yli-Paunu (Kalmar), Verne Hartikainen (Epec), and Vesa Kiviranta (Unikie), who shared practical experiences and insights into emerging trends in the mobile machinery industry. Business Tampere’s chip specialist Sampo Härkönen opened the event. Photo: Petri Kangas / Business Tampere Pasi Pylväs, Director, FiCCC. Photo: Petri Kangas / Business Tampere The event brought together professionals from the chip and machinery sectors. Front row: Sampo Härkönen, Vesa Kiviranta, Verne Hartikainen and Pekka Yli-Paunu. Photo: Petri Kangas / Business Tampere Tuomas Lahtinen, Veijo Kontas and Tomi Salo. Photo: Petri Kangas / Business Tampere The event venue, Technopolis Yliopistonrinne in Tampere. Photo: Petri Kangas / Business Tampere Photo: Petri Kangas / Business Tampere Chips From Tampere news packaging semiconductors silicon video